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0800 783 478(Mon-Fri 11AM-7PM)

 19-21 Euston Street Rydalmere, NSW 2116, Australia

  0800 783 478

  [email protected]

Monday - Friday: 11:00am - 7:00pm
Weekend & NSW Public Holiday: Closed

  • Home /
  • MiJing High Precision BGA Reballing Stencil for iPhone 12 mini / 12 / 12 Pro / 12 Pro Max

MiJing High Precision BGA Reballing Stencil for iPhone 12 mini / 12 / 12 Pro / 12 Pro Max

MiJing High Precision BGA Reballing Stencil for iPhone 12 mini / 12 / 12 Pro / 12 Pro Max

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 Availability: In stock

Only 3 left

Retail $7.34 +GST
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  SKU: MJ-IPH-15

ITEM ID: 53707

Stock Sydney: Low Stock (28 Aug 8:44pm updated)

Stock Melbourne: Low Stock (28 Aug 8:44pm updated)

Warranty: 30-Days Warranty

AU Dedicated Overnight Line
(3:30PM SYD/MEL AEST Cut-off time): Available

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Details

Features:

- MJ high-quality BGA Reballing Stencil, 100% new brand and high quality.

- Ultra-thin steel template, just 0.12mm thickness, easy to use.

- Laser engraving, Grooves staircase.

- German Craftsmanship, Quick hand, Pinpoint.

- Support for: iPhone 12 mini / 12 / 12 Pro / 12 Pro Max

Notice:

- Please Planting tin net again the chip foot, the temperature of the hot air gun is controlled within 250 degrees.

- The too high temperature is going to make the product deformed, secure with tweezers planting tin net.

- Apply the solder paste evenly, make sure than each hole is covered with solder paste, clean the surface of the steel net with a clean cloth.

- Then blow and weld the ball with a hot air gun, after cooling slightly the steel net tube is separated from the chip.

Specifications

Warranty

30-Days Warranty

Reviews

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You're reviewing: MiJing High Precision BGA Reballing Stencil for iPhone 12 mini / 12 / 12 Pro / 12 Pro Max

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